Samsung has confirmed development of its next flagship mobile processor, the Exynos 2700, in a move that strongly points to the chip being used in the upcoming Galaxy S27 series.

Samsung System LSI President Park Yong-In reportedly told staff during a management briefing that development of the Exynos 2700 was progressing “without setbacks” and that the chip was being prepared for “top-tier smartphones.”

While Samsung has not named the Galaxy S27, the company’s Galaxy S range has traditionally been the launch vehicle for its latest Exynos silicon in select markets.

The confirmation comes as Samsung attempts to rebuild confidence in its in-house smartphone processors after several Galaxy S generations shifted fully or partly to Qualcomm Snapdragon chips.

Reports suggest the Exynos 2700 will be built on Samsung Foundry’s second-generation 2nm process, known as SF2P, and could bring meaningful gains in efficiency rather than just raw performance.

Previous leaks have claimed Samsung is targeting a 12% performance improvement, a 25% reduction in power consumption and an 8% smaller chip design compared with earlier silicon.

Thermal performance is also expected to be a major focus.

Samsung is reportedly working on improved cooling technologies, including Heat Path Block and Side-by-Side packaging designs, aimed at sustaining performance under load.

That will be important if Samsung wants the Exynos 2700 to compete with Qualcomm’s next-generation Snapdragon flagship platform, expected to power Galaxy S27 models in some regions.

Samsung’s chip division is also under pressure. Reports from South Korea claim its System-on-Chip unit is facing losses due to weak demand and costly 2nm manufacturing challenges.

Despite this, Samsung is reportedly targeting the Exynos 2700 for up to half of global Galaxy S27 shipments.