Samsung Electronics will begin mass production of three-nanometre semiconductors next week, beating TSMC to the punch.
TSMC, the world’s largest contract chip maker, plans to begin 3nm mass production in the second half of the year.
Samsung says the chips will be built on the Gate-All-Around technology, allowing 45 per cent size reduction, 50 per cent lower power consumption, and 30 per cent higher performance, compared to the current FinFET process.
US President Joe Biden got a sneak peek of the technology last month, when he visited Samsung’s factory in Pyeongtaek, 70km south of Seoul.
“First is technology, second is technology and third is also technology,” Samsung Electronics Vice Chairman Lee Jae-yong said of his company’s future plans in the semiconductor realm.
Samsung has earmarked A$218.5 billion in the logic chip and foundry sectors by 2030.
